Titanium Planar Sputtering Target
Material: Titanium
Purity: 99.7%~99.995%
Proportion(wt%): 5-80 tungsten
Shape: Rectangle
Size: 685.8*127*6MM(Customization is available)
Copper back: 706.12 * 147.32 * 8 mm
Packing: Vacuum packing
Usage: Semiconductor, CVD, PVD
