Tungsten Titanium Sputtering Target
Material: Tungsten 90% + Titanium10%; Mixed materials,HIP
Purity: 99.9-99.99%
Proportion(wt%): 5-80 tungsten
Process: CNC Machining
Shape: Round
Size: dia 25~250mm(Customization is available)
Thickness: 32mm
Packing: Vacuum packing
Usage: Semiconductor, CVD, PVD
